Application of horizontal plating process in PCB electroplating

In order to adapt to the needs of high aspect ratio through hole plating. However, due to the complexity and particularity of electroplating process, the horizontal plating technology has come into being. There are still some technical problems in designing and developing the horizontal plating system. This needs to be improved in the course of practice.

Nevertheless, the use of the horizontal plating system is a great development and progress for the printed circuit industry. Because of this type of equipment in the manufacture of high-density multilayer panels, shows great potential, not only can save manpower and operation time, and production speed and efficiency than traditional vertical electroplating line higher. Moreover, the utility model reduces the energy consumption, reduces the waste liquid, the waste water and the waste gas which need to be processed, and greatly improves the technological environment and conditions, and improves the quality level of the plating layer.

The level of the plating line is suitable for large scale production of 24 hours of uninterrupted operation, the level of the plating line when debugging a vertical plating line slightly harder, if debugging is very stable at the same time to monitor the plating solution in the process of using the plating solution adjusted to ensure stable operation for a long time.

The way PCB is placed is changed from vertical to parallel plating. The PCB is the cathode, according to the characteristics of the horizontal plating. The current supply method is horizontal, and the electroplating system adopts two kinds of conductive clamp and conductive roller. From the convenience of the operating system, the use of roller conductive supply is more common. The conductive roller in the horizontal plating system has the function of transmitting PCB besides the cathode.. Therefore, most of the horizontal plating systems are designed to switch to anode, and a set of auxiliary cathodes can be used to dissolve the copper on the plated wheel.

Also consider the convenience of operation and automatic control of process parameters. Because in actual electroplating, when manufacturing a horizontal plating system. With the PCB size, hole diameter and size of the required thickness of copper, different transmission speed, PCB distance, pump horsepower size, nozzle direction and current density of the parameters need to be set, the actual test and adjust and control, to get it the thickness of the copper layer technical requirements. Computers must be used for control.

Product quality is more reliable, the development of electroplating technology is not accidental, but the high density, high precision, multi-function, high aspect ratio, multi-layer PCB products, the need for special functions is an inevitable result. The advantage is that it is more advanced than the vertical plating process adopted now. Large-scale production can be realized. Compared with the vertical electroplating process, the present invention has the following advantages:

No need for manual hanging, to adapt to a wide range of sizes. The realization of all automation operations is of great benefit to improve and ensure the operation process without damage to the surface of the substrate and to realize large-scale production. No need to keep the clamping position in the process review. The utility model increases the utility area, and greatly saves the consumption of raw materials. To make the substrate under the same conditions, the horizontal plating is controlled by the whole computer. Ensure the uniformity of the appearance of each PCB and the coating of the hole.

The addition and replacement of plating bath and plating bath. From the management point of view, the automatic operation can be fully realized, not because of human error caused by the management of out of control problems. As a result of horizontal plating using multistage horizontal cleaning, from actual production can be measured. Greatly reduce the amount of cleaning water and reduce the pressure of sewage treatment.

Reduce the pollution of the operating space and the direct influence of heat evaporation on the process environment. Because the system uses closed operation. Greatly improve the operating environment. In particular, when the drying plate is used, the waste of energy is saved and the production efficiency is greatly improved by reducing the loss of heat.


(Source: intenral information)

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