Key factors in future PCB design

Here I must admit, at last laid a large hand double audio device and circuit board, although I designed and produced many 6 ~16 layers ranging from PCB circuit board, but no block adopts a unique hole technology. So far I haven't tried the hole buried / blind via circuit board or pad through hole technology. Have you tried? Laser drilling? Science fiction? No.

In practice, we usually design the power / ground layer more closely to facilitate the production of circuit board manufacturers. This design provides distributed decoupling capacitors for high speed circuits. But ultimately, it is necessary to use FaradFlex or Interra and other products, can achieve one hundred times higher than the standard PCB material and even more than the capacitance. These layers can be embedded in the PCB stack.

Embedded resistors are another layer of subversion of traditional components. In fact, embedded resistors can be combined with embedded capacitors, such as FaradFlex on Ohmega.

Do you know the local PCB manufacturer? If you know the words would be easier. Find a can meet all kinds of technical level of company cooperation, many of these companies will provide all kinds of manual, detailing their support technology and materials, recommended practice DFM method etc..

In the process of defining PCB, a number of factors affect the final cost of the product and determine which manufacturer has the capacity to manufacture the product. Line and space dimensions to achieve the minimum is a basic standard, in general, the default value of 4 mil, while the 5 mil provides a lower cost of choice. 3 mil? To do this cost will be high. What about special substrates? Have you ever had a successful case of using a common FR-4 glass epoxy resin in a high frequency RF or high speed digital environment? I have not yet used a special material, but a few years ago, the design of a 3Gbit/s backplane will be able to use these special materials, so that some of the longer links may not have to reduce its data transfer rate.

With the increase of frequency, the material has become the key factor. From a more macro level, the braiding of the glass fiber can seriously affect the orbital impedance, leading to the failure of the reflection and differential pairs. From the micro level, the surface roughness of copper will affect the frequency of 10GHz or 20GHz. The more rough the surface of copper, the greater the loss.

I'm curious about your PCB skills. I know these advanced processes and technologies have been around for some time, but it seems that it has always been the privilege of a large company that is beyond my reach. Do you have any experience in using advanced PCB technology in small projects? Or are these processes and technologies only available for high capacity or advanced design?


(Source: Inside information)

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