MCPCB aluminum substrate and structure description

MCPCB aluminum substrate some restrictions, in the operation of the circuit system can not be more than 140 DEG C, this is mainly from the dielectric layer (dielectric layer, also known as insulated layer, insulation layer) limit, in addition in the manufacturing process shall not be more than 250 DEG to 300 DEG C, which before when the tin stove must prior knowledge.

2mcpcb aluminum substrate structure


MCPCB aluminum substrate structure by the circuit layer (Tong Boceng), thermal insulation layer and metal base composition. Layer circuit requirements with large current carrying capacity, and should be used with thick copper foil, thickness 35 mu m~280 m; heat conduction insulating layer is where the PCB aluminum substrate core technology, it is generally filled by special ceramics special polymer composition, small heat resistance, excellent viscoelastic properties, with thermal aging ability, able to withstand mechanical and thermal stress. IMS-H01, IMS-H02 and LED-0601 and other high performance aluminum PCB substrate thermal insulation layer is the use of this technology, which has very good thermal conductivity and high strength of the electrical insulation performance; base metal is aluminum substrate support member, with high thermal conductivity, usually aluminum, can also be used copper (copper plate can provide better thermal conductivity), suitable for drilling, punching and cutting, and other conventional machining. Process requirements are: gold plating, tin spraying, OSP oxidation, heavy gold, lead-free tin spraying, etc..

MCPCB aluminum substrate with heat dissipation metal base plate a unique metal base copper clad laminate (see below) (contains MCPCB aluminum substrate. MCPCB copper substrate, MCPCB iron-based plate), it has good thermal conductivity, electrical insulation performance and machining performance.


 

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