Circuit Board Circuit Board Plate

FR-1: fire-retardant phenolic paper copper-clad laminates. IPC4101 detailed specification No. 02; Tg N / A;

FR-4: 1) flame retardant epoxy E-glass cloth copper clad laminates and adhesive sheet material. IPC4101 detailed specification No. 21; Tg≥100 ℃;

2) flame retardant copper clad modified or unmodified epoxy E-glass cloth laminate and adhesive sheet material. IPC4101 detailed specification No. 24; Tg 150 ℃ ~ 200 ℃;

3) flame retardant copper clad epoxy / PPO glass cloth laminate and adhesive sheet material. IPC4101 detailed specification No. 25; Tg 150 ℃ ~ 200 ℃;

4) modified or unmodified retardant copper clad epoxy glass cloth laminate and adhesive sheet material. IPC4101 detailed specification No. 26; Tg 170 ℃ ~ 220 ℃;

5) E retardant epoxy glass cloth copper clad laminates (used in catalytic additive method). IPC4101 detailed specification No. 82; Tg N / A;


 

(Source: Circuit board circuit board plate)

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