Complex PCB Components For PCB Lead Free Challenges

Lead has a very wide range of applications in the electronics industry because of its low price, good electrical conductivity and relatively low melting point. However, according to the relevant international conventions, especially the EU regulations, the technical standards of many countries and consumers of electronic products stipulate that the use of harmful materials should be eliminated in the sale of goods. As a result, despite its popularity, the electronic industry continues to look for alternatives to lead.


What impact does lead-free soldering technology have on PCB components?


In general, PCB components with a wide variety of electronic components must undergo welding processes during assembly, and wave soldering is a commonly known welding method. When PCB components are converted to lead-free wave soldering, many challenges can be encountered. Just as any new manufacturing technology goes into product manufacturing, one may make a preliminary estimate of a number of relevant challenges and prepare for them in advance.


In fact, the lead-free assembly process is not a very novel process technology, lead-free wave soldering has been used for many years. In the RoHS regulations worked out before a long period of time, the melting temperature of electronic assembly engineer has suffered due to the use of silver tin electrode is high, so the need to adopt high temperature welding operation.

These electronic components are designed to meet the requirements of harsh environments, and because of their relative complexity, they are acceptable. When the RoHS regulations were introduced into the mainstream areas of electronic assembly, the early product as a transition was relatively simple, including consumer electronics.


By using single or double sided PCB components, people use relatively troublesome SMT devices on the solder joint of PCB. The transition to lead free transition of such electronic components is essentially straightforward and requires no major changes to the process parameters set out originally from tin lead alloy. In many cases, even the most original solder applied to tin lead alloys can also be successfully used in lead-free process operations.


With thick layers of PCB, with more and more complex electronic components (such as circuit board switch) into the transition from the tin lead alloy to lead-free welding process, in the operational aspects of the differences between the tin lead alloy with lead-free alloy increases.


Part of the problem in these areas has been reflected through the actual operation, but it is too late to carry out further research work on them, which is required by the large production base, the only way to provide the required information. Now, some of the higher complexity components have been put into mass production, and the challenges come mainly from the following points:


1. as the thickness of the circuit board increases, the challenge of hole filling increases exponentially.

2. a large number of wiring layers and a large number of ground connections make the hole filling problem worse.

3. as the signal and ground formation continue to increase, thermal mass increases, challenging pre heating work.

4. if the solder scraper is selected, they will mask the preheated area of the PCB, which further aggravates the problem of pre heating.


 

(Source: internal information)

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